JPS6146050B2 - - Google Patents

Info

Publication number
JPS6146050B2
JPS6146050B2 JP56119893A JP11989381A JPS6146050B2 JP S6146050 B2 JPS6146050 B2 JP S6146050B2 JP 56119893 A JP56119893 A JP 56119893A JP 11989381 A JP11989381 A JP 11989381A JP S6146050 B2 JPS6146050 B2 JP S6146050B2
Authority
JP
Japan
Prior art keywords
resin
comb
mold
sealing
plungers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56119893A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5821343A (ja
Inventor
Hisakazu Omoto
Akira Kamikubo
Akira Kawabata
Yasuo Taki
Katsuyuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11989381A priority Critical patent/JPS5821343A/ja
Publication of JPS5821343A publication Critical patent/JPS5821343A/ja
Publication of JPS6146050B2 publication Critical patent/JPS6146050B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP11989381A 1981-07-29 1981-07-29 樹脂封止装置 Granted JPS5821343A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11989381A JPS5821343A (ja) 1981-07-29 1981-07-29 樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11989381A JPS5821343A (ja) 1981-07-29 1981-07-29 樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS5821343A JPS5821343A (ja) 1983-02-08
JPS6146050B2 true JPS6146050B2 (en]) 1986-10-11

Family

ID=14772827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11989381A Granted JPS5821343A (ja) 1981-07-29 1981-07-29 樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS5821343A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039243U (ja) * 1983-08-24 1985-03-19 坂東　一雄 半導体素子の樹脂封入成形機

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE11053T1 (de) * 1980-12-12 1985-01-15 Dynamit Nobel Aktiengesellschaft Transparentes, kochwasserbestaendiges und sterilisationsfestes polyamid.

Also Published As

Publication number Publication date
JPS5821343A (ja) 1983-02-08

Similar Documents

Publication Publication Date Title
US4480975A (en) Apparatus for encapsulating electronic components
EP0787569B1 (en) Method of producing epoxy resin-encapsulated semiconductor device
TWI689400B (zh) 樹脂成型裝置及樹脂成型品的製造方法
JP3182432B2 (ja) 電子部品をカプセルに入れる装置
US4812114A (en) New IC molding process
WO1995019251A1 (fr) Procede de soudage par resine de dispositifs semi-conducteurs
JPS59101322A (ja) 熱可塑性樹脂のプレス成形方法
US7608486B2 (en) Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
JPS6146050B2 (en])
US6869556B2 (en) Molding system for semiconductor packages
GB2104827A (en) Molding of electronic components
JPS6146051B2 (en])
JPH0257006B2 (en])
JP7661285B2 (ja) 成形型、樹脂成形装置及び樹脂成形品の製造方法
JPS6354218B2 (en])
EP0870588B1 (en) Resin molding apparatus
JP2004140047A (ja) 樹脂封止装置
US5169586A (en) Method of manufacturing resin-sealed type semiconductor device
JPS61114824A (ja) レジンモ−ルド装置
EP1259981B1 (en) Device and method for encapsulating electronic components mounted on a carrier
JP2996427B2 (ja) 電子部品モールド金型
JP6966406B2 (ja) 電子制御装置、同製造装置、及び同製造方法
JPH0716879A (ja) 電子部品モールド金型
JPS59172241A (ja) 半導体樹脂封止装置
JPH0242651B2 (en])